Thermal optimisation of the assembly process and components is a central issue in the development of new products. The temperature distribution of energised PCBs and individual components can be analysed very well by using powerful thermography systems, while hotspots can be tracked in the image area at the same time.
Micro-thermography opens up new possibilities for quality control and developmentComplex electronics are becoming more powerful and smaller, so that in their development, thermal management is becoming increasingly important. The placement of electronic components on printed circuit boards is done in a small space, so good heat dissipation is necessary. Micro-thermography allows for the thermal analysis of extremely small structures in the micrometer range, providing a detailed representation of the temperature distribution on complex electronic assemblies and components.
Modular system design for precisely fitting inspectionsThe versatile application options of active thermography require an elaborate configuration of every single inspection system. InfraTec offers a wide variety of necessary components along with a modular system architecture. The high-resolution infrared cameras, efficient control and evaluation software as well as the continuously operable excitation sources and controllers are interchangeable within the system and therefore allow a flexible adaptation to upcoming requirements.
Accurate readings through special softwareIn contact-less temperature measurement, using infrared thermography in electronic assemblies, it should be noted that objects often have different emission behavior. For example, ceramics and plastics have a relatively high emissivity, while copper conductors and leads are very low.
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